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高通Qualcomm:2023年端侧AI:人工智能未来趋势报告(英文版)

发布者:wx****dc
2025-04-09
3 MB 17 页
人工智能(AI)
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高通Qualcomm:2023年端侧AI:人工智能未来趋势报告(英文版).pdf
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The future of AI is hybrid. As generative AI adoption grows at record-setting speeds1 and drives higher demand for compute,2 AI processing must be distributed between the cloud and devices for AI to scale and reach its full potential – just like traditional computing evolved from mainframes and thin clients to today’s mix of cloud and edge devices. A hybrid AI architecture distributes and coordinates AI workloads among cloud and edge devices, rather than processing in the cloud alone. The clo


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