高通Qualcomm:2023年端侧AI:人工智能未来趋势报告(英文版).pdf |
下载文档 |
资源简介
The future of AI is hybrid. As generative AI adoption grows at record-setting speeds1 and drives higher demand for compute,2 AI processing must be distributed between the cloud and devices for AI to scale and reach its full potential – just like traditional computing evolved from mainframes and thin clients to today’s mix of cloud and edge devices. A hybrid AI architecture distributes and coordinates AI workloads among cloud and edge devices, rather than processing in the cloud alone. The clo
已阅读到文档的结尾了