TechInsights：2025年存储技术趋势与展望报告：聚焦DRAM和NAND技术（英文版）

W2W format (YMTC Xtacking 1.0/2.0/3.0/4.0 HB 3D NAND Products, KIOXIA BiCS8 CBA 218L Products) ✓ 3D NAND peripheral circuitry prepared on a wafer separately from a multi-stack processed array wafer ✓ More solid logic transistors with well VT controlled, more flexible applications ✓ Challenges: alignment, local uniformity, mechanical stress, topography/CMP dishing voids, cleanliness, Smaller pitches