MKS：2025年先进封装手册：制程技术（英文版）

A semiconductor package (component level/level 1) is the enclosure of one or more integrated circuit (IC) dies and serves as a bridge between the IC (chip level/level 0) and the next assembly level (board level/level 2), allowing for easy integration into electronic applications and systems (system level/ level 3). Figure 1 illustrates the main purposes of a package [1,2]: Interconnect to the Next Assembly Level: The package facilitates electrical interconnection between the die and the exter