美国半导体协会：2025年美国政府的半导体投资研发重点重大挑战报告（英文版）

High-performance computing (HPC) underpins U.S. technology leadership, enabling national priorities including artificial intelligence (AI), machine learning, and scientific discovery. As highlighted in the 2025 Semiconductor Research Corporation (SRC) Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap, AI workloads have shifted from emerging to dominant, reshaping both data center and edge computing. However, as deployment of AI continues and demand accelerates, global data ce